Sinoceram Technology(Zhengzhou)Co.,ltd
telephone:0371-56900628
mailbox:sinoceram@qq.com
address:Dengfeng city of henan province industrial concentration area jade Beijing road

CERAMIC SUBSTRATES USED IN HICThe current position: Home > CERAMIC SUBSTRATES USED IN HIC

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Products Introduction:96% Al2O3  ceramic substrates,lasered substrates and stamped substrates.
Applications of Material :
    The company produces high performance Al2O3 ceramic substrates with international advanced technologies. Our products have been widely used in the fields of telecommunication, automotive engineering, direct bonding copper (DBC), printer, LED lights etc, and heat diffusing boards of electronic components. We can produce various products with different sizes and shapes according to customer requirements.


Characteristics of 96% Al2O3  ceramic substrates:
High thermal conductivity
Good thermal shock resistance
Good surface quality, flat surface
High dielectric strength , low dielectric constant and dielectric loss
Good mechanical hardness
Steady physical and chemical property, anti-erosion

Good stability,good wresting properties, excellent precision in size。

项目
Characteristic
测试条件
Test condition
单位
Unit
合格
Qualified
优级
Fine
外观
Color
 
 
白色 致密
White dense
白色 致密
White dense
单晶粒度
Grain size
 
μm
3~5
3~5
表面粗糙度
Surface Roughness
Ra
μm
0.2~0.6
0.2~0.4
密度
Density
 
g/cm3
≥3.70
≥3.72
物理性能
Physical properties
抗弯强度
Flexural strength
3点抗弯
 Three point
MPa
≥300
≥330
维氏硬度
Hardness
负荷 4.9
Loaded 4.9
GPa
≥14
≥15
吸水率
Water absorption
 
%
0
0
热性能
Thermal properties
 
热导率
Thermal conductivity
25
W/(m*k)
≥21
≥24
热膨胀系数
 thermal expansion
25-800
1×10-6mm/
6.6~7.9
6.6~7.9
抗热震性
Thermal shock resistance
850
≥6
比热Specific heat
 
J/(kg*K)
880
电性能
Electrical property
介电常数
Dielectric constant
1MHz/25
 
9.4±0.3
介电损耗
Dielectric loss
1MHz/25
×10-4
≤3
体积电阻率
Volume resistivity
25
Ω*cm
>1014
>1014
击穿电压
Breakdown voltage
 
KV/mm
>12
>12
规格
Size
可根据客户要求制作各种规格产品(长宽尺寸,厚度),分模压片和激光划片。
Size and any thickness accords to customer requirement by tooling pressing and laser process